Ultratech Inc. (UTEK)
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Ultratech, Inc. develops, manufactures and markets photolithography, laser thermal processing, and inspection equipment.

The Company manufactures for manufacturers of semiconductor devices, including advanced packaging processes and various nanotechnology components, such as thin film head magnetic recording devices (thin film heads or (TFHs)), laser diodes, high-brightness light emitting diodes (HBLEDs) and atomic layer deposition (ALD) for customers located throughout North America, Europe, Singapore, Japan, Taiwan, Korea and the rest of Asia. The Company supplies step-and-repeat photolithography systems based on one-to-one (1X) imaging technology to customers located throughout North America, Europe and Asia. In December 2012, it purchased certain assets of Cambridge NanoTech, Inc. (Cambridge).


The Company offers two different series of 1X lithography systems for uses in the semiconductor fabrication process: the 1000 series, which addresses the markets for HBLED, semiconductor fabrication and nanotechnology applications, and the AP series, which is designed to meet the requirements of the advanced packaging market. Its steppers are used to manufacture semiconductors used in a variety of applications, such as communications, personal computing, automotive control systems, power systems and consumer electronics. It also supplies 1X photolithography systems to thin film head manufacturers. These steppers offer minimum feature size capabilities ranging from 2.0 microns to 0.75 microns. The 1000 series systems are small field systems available with gh-line, i-line and broadband ghi-line illumination options. The Company offers the Sapphire 100 and Sapphire 100E for HBLED applications, the Star 100 for semiconductor and nanotechnology applications, and the Nanotech 190 for data storage applications for backend TFH processing. These 1000 series platform systems are typically used in the manufacture of HBLED's, power devices, ASICs, analog devices and compound semiconductors. In addition, this platform is used for a number of nanotechnology applications. The Sapphire 100 and the Sapphire 100E are also based on the 1000 Series platform, with additional features developed specifically for HBLED lithography applications.

For the advanced packaging market, the Company offers its AP series built on the Unity Platform. These advanced packaging systems were developed for high volume flip-chip and WLCSP manufacturing and 3-D packaging applications. They provide broadband or selective exposure (gh, i, or ghi-line), and are used in conjunction with downstream processes to produce a pattern of bumps, or metal connections, on the bond pads of the die for flip chip devices. The AP series, consisting of the AP300W, AP300L, AP300 and AP200, is built on the Company's Unity Platform. Designed specifically for advanced packaging applications, the AP systems integrate the processing advantages associated with the Company's advanced packaging lithography equipment with the productivity benefits of its Unity Platform. In addition to the base models, AP300 and AP200, the AP300W is a tool designed for high volume applications and the AP300L targeted for cost sensitive customers that do not need all of the advanced capabilities associated with the Company's flagship product offering, such as the low end outsourced semiconductor assembly and test (OSAT) market segment.

The Company offers a family of advanced laser-based thermal annealing tools built on its Unity Platform, the LSA100A, LSA101, LSA101LP, LSA101HP, LSA201, LSA201LP and LSA201HP. In addition to the Company's flagship model, the LSA101, which enables junction activation and other advanced front-end annealing processes for the 28nm node and below, the Company has introduced a novel dual beam technology extending the system's capabilities to lower processing temperatures (LSA101LP) or to extend the system's capabilities to longer dwell times (LSA101HP). The LP dual beam is targeted to enable middle-of-line (MOL) applications, such as nickel silicide formation, while the HP dual beam temperature profile has the potential to open up new applications, such as annealing out implant-related defects with minimal dopant diffusion. LSA201 enables wafer ambient control processing targeted for sub-20nm nodes. The LSA201 platform can also be configured with either of the dual beam lasers mentioned above-named the LSA201LP and the LSA201HP.

The Company competes with Canon Incorporated, Nikon Corporation, Suss Microtec AG, Rudolph Technologies, Inc., Ushio, Dainippon Screen Manufacturing Co., Ltd., Applied Materials, Inc. , KLA-Tencor, Nanometrics, Rudolph, Frontier Semiconductor and Mattson Technology, Inc.

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Company Website - http://www.ultratech.com
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