NeoPad Technologies Corp., a Hillsboro, Ore.-based maker of CMP pads, has raised just over $14 million in Series C funding. “Neopad Technologies Corporation designs, tests, and manufactures highly specialized CMP pads using proprietary nanoparticle and nanocomposite technology for the production of advance semiconductors and hard drives. Utilizing a very repeatable compression molded manufacturing process, our […]
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Beeco, Inc., a semiconductor company created with technology developed at RTI International, announced today that it has closed a $5 million financing round. Beeco is developing the next generation of chip level integration through a Silicon Integrated Circuit Board (SICB) technology platform. The SICB platform allows for the integration of semiconductor devices on a silicon […]
Crossing Automation Inc., a Mountain View, Calif.-based wafer automation company, has raised $6.07 million in additional Series A funding. “Our specialty is to deliver cost effective, innovative and highly reliable solutions for transferring wafers into and out of process and metrology tools during the chip manufacturing process. Our patent pending system driven architectures are uniquely […]
Molecular Imprints, Inc., the market and technology leader for volume-production nanopatterning systems and solutions, today announced the successful completion of $12.9 million in financing. Molecular Imprints, Inc. (MII) is the technology leader for high-resolution, low cost-of-ownership nanopatterning systems and solutions in the hard disk drive (HDD) and semiconductor industries. MII is leveraging its innovative Step […]
Multigig, Inc., a technology leader in next generation clock and timing solutions, today announced that it has closed a $12.5 million Series B round of funding. “Multigig clearly has breakthrough circuit technology that significantly shifts the power-performance curve for existing semiconductor processes,” said Faysal Sohail, managing director at CMEA Ventures. “This is particularly true for […]
CrossingAutomation Inc., a Mountain View, Calid. based maker of automated wafer transfer systems, has expanded its Series A round to around $6 million. “Our specialty is to deliver cost effective, innovative and highly reliable solutions for transferring wafers into and out of process and metrology tools during the chip manufacturing process. Our patent pending system […]
Qcept Technologies Inc., the developer of a new breed of wafer inspection systems for the semiconductor manufacturing industry, today announced that it has raised $9.5 million in Series C funding. Qcept delivers wafer inspection solutions for non-visual defect (NVD) detection in advanced semiconductor manufacturing. Qcept’s ChemetriQ® platform is being adopted in critical processes for inline, […]
Mobius Microsystems Inc. said Monday it closed a second round of funding with $10.22 million. Mobius Microsystems is an innovator in analog and mixed signal designs, and is the first to implement highly accurate frequency generators entirely in standard CMOS. This is a significant technical breakthrough in a class of frequency generation, which to date […]
Mobius Microsystems, Inc. raises $10.22 million. Mobius’ patented CMOSHarmonic Oscillator (CHO) technology is implemented on a single piece of silicon and enables system designers to create smaller, thinner, and more mechanically robust products. With its low phase noise and jitter, the CHO provides a more suitable frequency reference for serial interfaces than quartz crystals by […]
Silicon Clocks raises $8,000,000 in financing. Silicon Clocks is turning its innovative, patented MEMS technology into products designed to solve one of the final integration hold-outs: the integration of the resonator function on chip. By putting MEMS technology on top of standard CMOS, Silicon Clocks for the first time enables the integration of large numbers […]
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